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Home > Products > VIKING > Heat -Dissipation Ceramic Substrate

> VIKING > Heat -Dissipation Ceramic Substrate Download

General Specification and Process Capability

 
Substrate
Via Hole
Adhesion / Seed Layer
Functional / Conductive Layer
Barrier / Bonding Layer
Passivation Layer

Al2O3
17 - 27 W/mK
Up to 4.5"

50 - 200 um
Ti / Cu
Electroplating Cu
5 - 100 um in thickness
Electroplating Cu
5 - 100 um in thickness
Solder Mask
25 - 30 um in thickness
TiW / Ti / Cu
Electroplating Au
0.1 - 5.0 um in thickness
Electroless Ag
0.1 - 1.0 um in thickness
Polyimide
3 - 8 um in thickness

AlN
170 - 220 W/mK
Up to 4.5"

Cr / Cu
Printing Ag
10 um in thickness
Electroplating Ni / Au
3 - 9 um / 0.5 - 1.5 um in thickness
SU-8
2 - 10 um in thickness

Printing Cu
10 um in thickness

Electroplating Ni / Ag
3 - 9 um / 3.0 um in thickness

 

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